Design and Modeling for 3D ICs and Interposers EBOOK Tooltip

Taal: Engels
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  • Engels
  • E-book
  • 9789814508612
  • Druk: 1
  • november 2013
  • 380 pagina's
  • Adobe ePub
Alle productspecificaties

Samenvatting

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.


Contents:

  • System Integration and Modeling Concepts

  • Modeling of Cylindrical Interconnections

  • Electrical Modeling of Through Silicon Vias

  • Electrical Performance and Signal Integrity

  • Power Distribution, Return Path Discontinuities and Thermal Management

  • Alternate Methods for Power Distribution




Readership: Graduate students, academics, researchers in electrical and electronics engineering, computer engineering, semiconductors and packaging.

Key Features:

  • This is the first comprehensive book on the topic

  • Provides a comprehensive analysis of both silicon and glass interposers and their comparison

  • In our humble opinion, Prof. Madhavan Swaminathan is very well known in the area of 3D Integration


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Productspecificaties

Inhoud

Taal
Engels
Bindwijze
E-book
Druk
1
Verschijningsdatum
2013-11-05
Aantal pagina's
380 pagina's
Ebook formaat
Adobe ePub
Bestandsgrootte ebook
10,2 MB
Illustraties
Nee

Betrokkenen

Auteur
Madhavan Swaminathan Ki Jin Han
Co-auteur
Ki Jin Han
Uitgever
WSPC

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9789814508612

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Extra groot lettertype
Nee
Oorspronkelijke releasedatum
2013-11-05
Thema Subject Code
TJFD

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