MRS Proceedings Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004

Auteur: Carter, R. J.
Taal: Engels
MRS Proceedings
  • Engels
  • Paperback
  • 9781107409224
  • juni 2014
  • 422 pagina's
Alle productspecificaties

Samenvatting

The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.

Productspecificaties

Inhoud

Taal
Engels
Bindwijze
Paperback
Verschijningsdatum
2014-06-05
Aantal pagina's
422 pagina's
Illustraties
Nee

Betrokkenen

Auteur
Carter, R. J.
Redacteur
R. J. Carter
Co-redacteur
G. M. Kloster
Uitgever
Cambridge University Press

EAN

EAN
9781107409224

Overige kenmerken

Extra groot lettertype
Nee
NUR code
950
Oorspronkelijke releasedatum
2014-06-05
Subtitel
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics - 2004
Thema Subject Code
TGM

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