Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability

Afbeeldingen

Artikel vergelijken

  • Engels
  • Hardcover
  • 9781461418115
  • 01 december 2011
  • 149 pagina's
Alle productspecificaties

Samenvatting

Metal-dielectric interfaces are ubiquitous in modern electronics.

Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces.

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them.

Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design. Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces

Features fundamental considerations in the physics and chemistry of metal-dielectric interactions

Explores mechanisms of metal atom diffusion and metal ion drift in dielectrics

Provides keys to understanding reliability in gigascale electronics

Focuses on a dynamic area of current research that is a foundation of futureinterconnect systems, memristors, and solid-state electrolyte devices

Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces

Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them.

Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.

Productspecificaties

Inhoud

Taal
en
Bindwijze
Hardcover
Oorspronkelijke releasedatum
01 december 2011
Aantal pagina's
149
Illustraties
Nee

Betrokkenen

Hoofdauteur
Ming He
Tweede Auteur
Toh-Ming Lu
Co Auteur
Toh-Ming Lu

Overige kenmerken

Editie
2012
Extra groot lettertype
Nee
Product breedte
155 mm
Product lengte
235 mm
Studieboek
Nee
Verpakking breedte
160 mm
Verpakking hoogte
15 mm
Verpakking lengte
242 mm
Verpakkingsgewicht
385 g

EAN

EAN
9781461418115
Nog geen reviews

Kies gewenste uitvoering

Prijsinformatie en bestellen

De prijs van dit product is 83 euro en 48 cent. De meest getoonde prijs is 110 euro en 99 cent. Je bespaart 25%. Dit is een tweedehands product.
Je bespaart 25%
Alleen tweedehands
Als nieuw
1 - 2 weken
  • Bestellen en betalen via bol
  • Prijs inclusief verzendkosten, verstuurd door Bogamo 1 - Boeken outlet
  • 30 dagen bedenktijd en gratis retourneren